Application of Fracture Mechanics in Electronic Packaging: Proceedings, ASME International Mechanical Engineering Congress and Exposition, Dallas, TX, 1997
Proceedings of the ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas. Collection of 23 full-length, peer-reviewed, technical papers show how applications of the mechanics of fracture help maintain the reliability of modern electronic components, even while they become "faster, smaller, and cheaper." Papers update developments in area since first symposium in 1995. Contents includes: "The Effect of Temperature and Humidity Exposure on...
Search in google:
Proceedings of the ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas. Collection of 23 full-length, peer-reviewed, technical papers show how applications of the mechanics of fracture help maintain the reliability of modern electronic components, even while they become "faster, smaller, and cheaper." Papers update developments in area since first symposium in 1995. Contents includes: "The Effect of Temperature and Humidity Exposure on Adhesion,' "Potential Failure Sites in a Flip-Chip Package With or Without Underfill," "Die Strength Evaluation in the Presence of Edge Cracks," "Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry," etc. By: William T. Chen and David T. Read Booknews Twenty-three technical papers from the November 1997 symposium show how applications of the mechanics of fracture help to maintain the reliability of modern electronic componentseven while they become faster, smaller, and cheaper. Topics include the effect of temperature and humidity exposure on adhesion; interfacial fracture toughness in plastic packages; a new approach for thermal fatigue testing of the underfill/passivation interface; potential failure sites in a flip- chip package with and without underfill; and the toughening of high performance epoxy adhesives using core-shell particles. Annotation c. by Book News, Inc., Portland, Or.
\ BooknewsTwenty-three technical papers from the November 1997 symposium show how applications of the mechanics of fracture help to maintain the reliability of modern electronic components<-->even while they become faster, smaller, and cheaper. Topics include the effect of temperature and humidity exposure on adhesion; interfacial fracture toughness in plastic packages; a new approach for thermal fatigue testing of the underfill/passivation interface; potential failure sites in a flip- chip package with and without underfill; and the toughening of high performance epoxy adhesives using core-shell particles. Annotation c. by Book News, Inc., Portland, Or.\ \
