Input/Output Interconnect Networks for Gigascale System
Make way for solutions to the challenges in chip reliability, power delivery, I/O signaling, and heat removal now blocking the way to ultimate performance 3D gigascale SoC. This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source.\ \ You get full details...
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Today's microchips have nearly reached their performance limits. Various heat removal, power delivery, chip reliability, and input/output (I/O) signaling problems stand in the way of next-generation 3D gigascale, system-on-a-chip technology, and this cutting-edge guide describes the latest breakthroughs in microfluidics, high-density compliant electrical interconnects, and nanophotonics that are converging to solve them. Engineers get full details on state-of-the-art I/O interconnects and packaging, along with the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication. It brings readers up to speed with the latest heat removal technologies including chip-scale microchannel cooling, integrated micropumps and fluidic channels, and carbon nanotube interconnects. MarketElectrical engineers and R&D developers whose work involves new chip and system-on-a-chip devices and technologies. Content HighlightsDie-Package Interaction and Impact on Low-k ILD. Mechanically Compliant I/O Interconnects and Packaging. Power Delivery Design and Analysis. Optical Interconnects and Various Approaches for Chip-to-Chip Signaling. CMOS Integrated Optical Devices. 3D Integration and Wafer Stacking Technology. Through-Wafer Interconnects. Integrated Micropumps and Fluidic Channels. CNT Thermal Properties & Applications for Heat Removal. Wafer-Level Testing and Probe Substrates. The Convergence of Semiconductor Technology and the Life Sciences.
Introduction: The Interconnect Problem.\ \ Die-Package Interaction and Impact on Low-k ILD.\ \ Mechanically Compliant I/O Interconnects and Packaging.\ \ Power Delivery Design and Analysis.\ \ Challenges for Off-chip Signaling & Communication.\ \ Optical Interconnects and Various Approaches for Chip-to-Chip Signaling.\ \ CMOS Integrated Optical Devices.\ \ 3D Integration and Wafer Stacking Technology.\ \ Through-Wafer Interconnects.\ \ Limits of Current Heat Removal Technology & Opportunities.\ \ Chip-Scale Microchannel Cooling — Planar and Vertical.\ \ Integrated Micropumps and Fluidic Channels.\ \ CNT Thermal Properties & Applications for Heat Removal.\ \ Wafer-Level Testing and Probe Substrates.\ \ The Convergence of Semiconductor Technology and the Life Sciences.\
