Handbook of Lead-Free Solder Technology for Microelectronic Assemblies (Mechanical Engineering Series)
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This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.
Preface1Overview of Lead-Free Solder Issues Including Selection12Health and Environmental Effects of Lead and Other Commonly Used Elements in Microelectronics493Environmental Impact of Lead and Alternatives in Electronics834Environmental Stewardship with Regional Perspectives and Drives of the Lead-Free Issue1155Market, Product, and Corporate Policy Trends1496The Metallurgical Aspects, Properties, and Applications of Solders from the Lead-Tin System1677Physical Basis for Mechanical Properties of Solders2118Sn-Ag and Sn-Ag-X Solders and Properties2399Bi-Sn, Sn-Sb, Sn-Cu, Sn-Zn, and Sn-In Solder-Based Systems and Their Properties28110High-Temperature Lead-Free Solders with Dispersoids30111Solder Wetting and Spreading33112Lead-Free Finishes for Printed Circuit Boards and Components43113Formation of Intermetallic Compounds at Pb-Sn/Metal and Lead-Free/Metal Interfaces in Solder Joints46514Electronics Assembly and the Impact of Lead-Free Materials49515Use of Inert Atmospheres in Lead-Free Soldering56916Pb-Free Component Conversion and Some Manufacturing Experiences59117Major International Lead (Pb)-Free Solder Studies66518Electrically Conductive Adhesives - A Lead-Free Alternative72919Reliability Aspects of Lead-Free Solders in Electronic Assemblies76920The Physics and Materials Science of Electromigration and Thermomigration in Solders82721The Structure and Kinetics of Tin-Whisker Formation and Growth on High Tin Content Finishes85122Degradation Phenomena915Index979Biographies1015
