Principles of Plasma Discharges and Materials Processing
"The first edition of Principles of Plasma Discharges and Materials Processing, published over a decade ago, was lauded for its complete treatment of both basic plasma physics and industrial plasma processing, quickly becoming the primary reference for students and professionals." "The Second Edition has been carefully updated and revised to reflect recent developments in the field and to further clarify the presentation of basic principles. Along with in-depth coverage of the fundamentals of...
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A Thorough Update of the Industry Classic on Principles of Plasma ProcessingThe first edition of Principles of Plasma Discharges and Materials Processing, published over a decade ago, was lauded for its complete treatment of both basic plasma physics and industrial plasma processing, quickly becoming the primary reference for students and professionals. The Second Edition has been carefully updated and revised to reflect recent developments in the field and to further clarify the presentation of basic principles. Along with in-depth coverage of the fundamentals of plasma physics and chemistry, the authors apply basic theory to plasma discharges, including calculations of plasma parameters and the scaling of plasma parameters with control parameters.New and expanded topics include:Updated cross sectionsDiffusion and diffusion solutionsGeneralized Bohm criteriaExpanded treatment of dc sheathsLangmuir probes in time-varying fieldsElectronegative dischargesPulsed power dischargesDual frequency dischargesHigh-density rf sheaths and ion energy distributionsHysteresis and instabilitiesHelicon dischargesHollow cathode dischargesIonized physical vapor depositionDifferential substrate chargingWith new chapters on dusty plasmas and the kinetic theory of discharges, graduate students and researchers in the field of plasma processing should find this new edition more valuable than ever. Booknews A text-reference that offers an integrated presentation of the fundamental physics and chemistry of partially ionized, chemically reactive, low-pressure plasmas and their roles in a wide range of plasma discharges and processes used in thin film processing applications, especially in the fabrication of integrated circuits. Includes many fully worked examples, practice exercises, and demonstrations of the relationship of plasma parameters to external control parameters and processing results. Annotation c. Book News, Inc., Portland, OR (booknews.com)
1Introduction12Basic plasma equations and equilibrium233Atomic collisions434Plasma dynamics875Diffusion and transport1336Direct current (DC) sheaths1657Chemical reactions and equilibrium2078Molecular collisions2359Chemical kinetics and surface processes28510Particle and energy balance in discharges32711Capacitive discharges38712Inductive discharges46113Wave-heated discharges49114Direct current (DC) discharges53515Etching57116Deposition and implantation61917Dusty plasmas64918Kinetic theory of discharges679App. ACollision dynamics723App. BThe collision integral727App. CDiffusion solutions for variable mobility model731
\ BooknewsA text-reference that offers an integrated presentation of the fundamental physics and chemistry of partially ionized, chemically reactive, low-pressure plasmas and their roles in a wide range of plasma discharges and processes used in thin film processing applications, especially in the fabrication of integrated circuits. Includes many fully worked examples, practice exercises, and demonstrations of the relationship of plasma parameters to external control parameters and processing results. Annotation c. Book News, Inc., Portland, OR booknews.com\ \ \ \ \ From the Publisher"The authors have done an excellent job…this is a good book for an academic course that will provide the foundation to senior-level and graduate students…" (MRS Bulletin, November2005)\ \
