The Smt Step-by-Step Collection 2006
The Surface Mount Technology columns, the "Step Series," are a mainstay in the semiconductor industry. Written by prominent industry leaders, each column from the 2005 year and published in SMT, addresses a critical 'step' in the manufacturing process, from the initial design stages through final rework. This technology driven series represents the most advanced research and creative solutions for the one of the most complex and capital intense industries in the world economy. In addition to...
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The Surface Mount Technology columns, the "Step Series," are a mainstay in the semiconductor industry. Written by prominent industry leaders, each column from the 2005 year and published in SMT, addresses a critical step in the manufacturing process, from the initial design stages through final rework. This technology driven series represents the most advanced research and creative solutions for the one of the most complex and capital intense industries in the world economy. In addition to the step series, SMT also includes its lead-free series of columns published in 2005. As the world prepares for lead-free manufacturing and the enactment of the Restrictions on Hazardous Materials directive, massive changes are happening for the surface mount assembly sector. The inclusion of these articles represents a year s worth of counsel, technology and research at a critical time for the industry.
• Guest Essay, SMT--An Industry in Transition, by Bob Rowland\ • Step-by-Step Collection\ • Step 1: Design for manufacture, by Charles Pfeil\ • Step 2: Process control, by Joe Belmonte\ • Step 3: Solder materials, by Brian Toleno\ • Step 4: Printing, by Joe Belmonte, Bob Boyes, and Alden Johnson\ • Step 5: Adhesives, epoxies, and dispensing, by Steve Collier\ • Step 6: Component placement, by Wessel Wesseling\ • Step 7: Soldering, by Karl Seelig\ • Step 8: Cleaning, by Tom Forsythe\ • Step 9: Test and inspection, by Stig Oresjo\ • Step 10: Rework and repair, by Jashir Bath and Quyen Chu\ • Lead-free series\ • Lead-free WEEE and RoHS issues to consider, by Thomas M. Cronin and Arthur N. Mabbett\ • Optimizing lead-free reflow processes, by Peter Biocca\ • Component compatibility takes center stage, by Lance Larrabee\ • Using vapor phase reflow in lead-free processing, by Steve Fraser and Chris Munroe\ • Soldering at the end of the line, by Charley Dennehy\ • Lead-free cleaning: Moving from eutectic to lead-free, by Umut Tosun\ • Controlling tombstoning behavior, by Benlih Huang and Ning-Cheng lee\ • The directives draw near, by Michelle M. Boisvert\ • Lead-free wave solder alloy selection: Reliability is key, by LeRoy Boone, Gerard P. Cambell, and Lourdes C. Palacio\ • Making the adjustments, by Tony Garramone\ • PCB test and inspection, by Paul R. Groome\ • Screen printing -- Where to from here? by Richard Heimsch
