Electronic Packaging and Interconnection Handbook
THE MOST COMPREHENSIVE REFERENCE IN ELECTRONIC PACKAGING—COMPLETELY UPDATED\ \ \ \ \ From new materials and technologies to increasingly prevalent lead-free manufacturing practices, Electronic Packaging and Interconnection Handbook offers a unique source of key reference data, practical guidance, and circuit and package design basics. Through three best-selling editions, this classic reference has served those involved in the design, manufacture, testing, and use of all types of electronic...
Search in google:
Intended for electronic engineers, this handbook describes the various approaches to handling thermal management issues in electronic packaging, the function and structure of connectors, and the properties of solder technologies for electronic assembly. Other topics of the ten chapters include integrated circuit packaging, ball grid arrays, hybrid microelectronics, multichip modules, chip scale packaging, flip chip attachment, and printed wiring boards. Originally published as Handbook of electronic packaging, the fourth edition adds material on microelectromechanical (MEM) systems and high speed technologies. Annotation ©2004 Book News, Inc., Portland, OR Sci-Tech Book News Intended for electronic engineers, this handbook describes the various approaches to handling thermal management issues in electronic packaging, the function and structure of connectors, and the properties of solder technologies for electronic assembly. Other topics of the ten chapters include integrated circuit packaging, ball grid arrays, hybrid microelectronics, multichip modules, chip scale packaging, flip chip attachment, and printed wiring boards. Originally published as Handbook of Electronic Packaging, the fourth edition adds material on microelectromechanical (MEM) systems and high speed technologies.
Ch. 1Plastics, elastomers, and compositesCh. 2Adhesives, underfills, and coatingsCh. 3Thermal managementCh. 4Connector and interconnection technologyCh. 5Solder technologies for electronic packaging and assemblyCh. 6Packaging and interconnection of integrated circuitsCh. 7Hybrid microelectronics and multichip modulesCh. 8Chip scale, flip chip, and advanced chip packaging technologiesCh. 9Rigid and flexible printed circuit board technologyCh. 10Packaging of high-speed and microwave electronic systems
\ Sci-Tech Book NewsIntended for electronic engineers, this handbook describes the various approaches to handling thermal management issues in electronic packaging, the function and structure of connectors, and the properties of solder technologies for electronic assembly. Other topics of the ten chapters include integrated circuit packaging, ball grid arrays, hybrid microelectronics, multichip modules, chip scale packaging, flip chip attachment, and printed wiring boards. Originally published as Handbook of Electronic Packaging, the fourth edition adds material on microelectromechanical (MEM) systems and high speed technologies.\ \ \ \ \ Sci-Tech Book NewsIntended for electronic engineers, this handbook describes the various approaches to handling thermal management issues in electronic packaging, the function and structure of connectors, and the properties of solder technologies for electronic assembly. Other topics of the ten chapters include integrated circuit packaging, ball grid arrays, hybrid microelectronics, multichip modules, chip scale packaging, flip chip attachment, and printed wiring boards. Originally published as Handbook of Electronic Packaging, the fourth edition adds material on microelectromechanical (MEM) systems and high speed technologies.\ \ \ BooknewsNew edition of a reference that covers all aspects of electronic packaging and its associated technologies. Harper (Technology Seminars, Inc.) includes contributions from leading experts to provide data, information and guidelines on topics including materials, thermal management, mechanical and thermomechanical stress behavior, connector and interconnection technology, wiring and cabling, soldering and solder technology, IC packaging and ball grid arrays, surface mount technologies, hybrid microelectronic and multichip modules, chip-scale and direct-chip-attach technologies, rigid and flexible printed-wiring boards, modeling, and high-speed, microwave, and high-voltage electronic systems. Contains many b&w illustrations. Annotation c. Book News, Inc., Portland, OR (booknews.com)\ \
