Electronic Packaging Materials and Their Properties
Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.\ Electronic Packaging Materials and Their Properties examines the array of packaging architecture,...
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Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:interconnectionsprinted circuit boardssubstratesencapsulantsdielectricsdie attach materialselectrical contactsthermal materialssolders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging. Booknews A text on the enclosures for integrated circuit chips, passive devices, the fabrication of circuit cards, and the production of a final product or system. The authors cover electronic packaging architecture, semiconductor materials, interconnection materials for component attachment to a substrate, materials used to fabricate a printed wiring board, quality and reliability issues, and the electrical, mechanical, chemical, and thermal properties of all electronic packaging materials. Includes many tables and diagrams which summarize relevant data. Annotation c. by Book News, Inc., Portland, Or.
Preface11Properties of electronic packaging materials31.1Electrical properties31.2Thermal and thermomechanical properties91.3Mechanical properties131.4Chemical properties171.5Miscellaneous properties202Zeroth-level packaging materials212.1Semiconductors212.2Attachment materials252.3Substrates materials303First-level packaging materials393.1Wire interconnects393.2Tape interconnects443.3Case materials473.4Lid seals503.5Leads544Second-level packaging materials574.1Reinforcement fiber materials574.2Resins624.3Laminates664.4Constraining cores754.5Flexible wiring board materials764.6Conformal coatings845Third-level packaging materials895.1Backpanel materials895.2Connector materials895.3Cables and flex circuit materials986Summary103Appendix A105Appendix B107References109Index113
\ BooknewsA text on the enclosures for integrated circuit chips, passive devices, the fabrication of circuit cards, and the production of a final product or system. The authors cover electronic packaging architecture, semiconductor materials, interconnection materials for component attachment to a substrate, materials used to fabricate a printed wiring board, quality and reliability issues, and the electrical, mechanical, chemical, and thermal properties of all electronic packaging materials. Includes many tables and diagrams which summarize relevant data. Annotation c. by Book News, Inc., Portland, Or.\ \
