Handbook Of Tape Automated Bonding
Handbook of tape automated bonding (TAB) is a one-stop guide to the state of the art of TAB technology - including TAB tape, bump, inner lead bonding, encapsulation, testing, burn-in, outer lead bonding, inspection, rework, thermal management and reliability. For professionals active in TAB research and development, those who wish to master TAB problem solving methods, and those who must choose a high-performance and cost-effective packaging technique for their interconnect systems, here's a...
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Handbook of tape automated bonding (TAB) is a one-stop guide to the state of the art of TAB technology - including TAB tape, bump, inner lead bonding, encapsulation, testing, burn-in, outer lead bonding, inspection, rework, thermal management and reliability. For professionals active in TAB research and development, those who wish to master TAB problem solving methods, and those who must choose a high-performance and cost-effective packaging technique for their interconnect systems, here's a timely summary of progress in all aspects of this fascinating field. Booknews A guide to the state of the art of TAB technology--including TAB tape, bump, inner lead bonding, encapsulation, testing, burn-in, outer lead bonding, inspection, rework, thermal management, and reliability. For professionals active in TAB research and development, those who wish to master TAB problem solving methods, and those who must choose a high-performance and cost-effective packaging technique for their interconnect systems. Annotation c. Book News, Inc., Portland, OR (booknews.com)
Foreward; Preface; Acknowledgments; A brief introduction to tape automated bonding; Electrical performance of tape automated bonding; First-level packaging costs: tape bonding versus other high-lead package options; Materials choices for tape automated bonding; TAB tape design and manufacturing; Wafer bumping; TAB inner lead bonding; TAB testing and burn-in; TAB encapsulation; TAB outer lead bonding; Equipment selection for TAB outer lead bonding; TAB inspection and rework; TAB thermal management; Reliability aspects of tape automated bonding; Multichip packaging with TAB; Interconnection substrates for TAB devices; TAB developments and trends in Europe; TAB developments and trends in Japan; TAB implementation: a case study in the military environment; TAB Implementation: a case study in the commercial environment; Index
\ BooknewsA guide to the state of the art of TAB technology--including TAB tape, bump, inner lead bonding, encapsulation, testing, burn-in, outer lead bonding, inspection, rework, thermal management, and reliability. For professionals active in TAB research and development, those who wish to master TAB problem solving methods, and those who must choose a high-performance and cost-effective packaging technique for their interconnect systems. Annotation c. Book News, Inc., Portland, OR (booknews.com)\ \
