Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a...
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The authors (all of the U. of Arizona) explain the use of ANSYS, a finite element software program, for analyzing fatigue life in solder joints. They begin with the theoretical basis of the method, moving onto the uses of ANSYS for the thermomechanical fatigue life prediction of electronic packages. Case studies are included to aid readers in regenerating solutions using the software programs included on the CD-ROM. Annotation (c)2003 Book News, Inc., Portland, OR
PrefaceList of CommandsList of TablesList of Figures1Introduction12Thermomechanical Fatigue Life Prediction Analysis173Mechanical Bending Fatigue Life Prediction Analysis694Macro Reference Library87App. AInstallation and Execution163App. BInput Listings for Case Studies175Index183
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