Chip On Board
This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality,...
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This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection. Booknews Chapters by various experts provide a reference for design, materials, processes, equipment, manufacturing, quality, reliability, packaging, and system engineers and technical managers. Topics include wire bonding, TAB, flip COB, testing, wafer bumping and inner lead bonding, solder bumped flip chips, chip attachments, wire bonding chip and TAB chip on board, micro bump bonding chips, chip on board encapsulation, and underfill encapsulation for flip chips. All those chips and no salsa. Annotation c. Book News, Inc., Portland, OR (booknews.com)
PrefaceAcknowledgments1A Brief Introduction to Wire Bonding, Tape Automated Bonding, and Flip Chip on Board for Multichip Module Applications12Making COB Testing Tractable: Chip Pretest and System Diagnostics1013Chip Level Interconnect: Wire Bonding for Multichip Modules1244Chip Level Interconnect: Wafer Bumping and Inner Lead Bonding1865Chip Level Interconnect: Solder Bumped Flip Chip2286Chip Attachment2517Wire Bonding Chip on Board2758Tape Automated Bonding Chip on Board and on MCM-D3439Solder Bumped Flip Chip Attach on SLC Board and Multichip Module41010Micron Bump Bonding Chip on Board44411Chip on Board Encapsulation47012Underfill Encapsulation for Flip Chip Applications504Authors' Biographies533Index545
\ BooknewsChapters by various experts provide a reference for design, materials, processes, equipment, manufacturing, quality, reliability, packaging, and system engineers and technical managers. Topics include wire bonding, TAB, flip COB, testing, wafer bumping and inner lead bonding, solder bumped flip chips, chip attachments, wire bonding chip and TAB chip on board, micro bump bonding chips, chip on board encapsulation, and underfill encapsulation for flip chips. All those chips and no salsa. Annotation c. Book News, Inc., Portland, OR (booknews.com)\ \
