MCM C/Mixed Technologies and Thick Film Sensors
Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity. MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film...
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Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity. MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond. MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area. Booknews The 31 papers address advances in multi-chip modules for electronic packaging, emphasizing but not limited to ceramic multi-chip technology. Describes applications in satellite communications, telecommunications, and militaries; materials and processes that have led to the increased density of interconnections; and ceramic thick-film, and environmental-gas, pressure, and temperature sensors. Specific topics include analyzing and optimizing circuit interconnect performance, laser processing, ceramic heat sinks, a motion estimator for high- definition television, and low permittivity porous silica thin films. Includes a slender key-word index. Annotation c. Book News, Inc., Portland, OR (booknews.com)
Preface3-D Interconnection Microsystems ApplicationsHigh Performance Packaging with Multilayer Ceramic ModulesHigh Frequency LTCC ModulesAnalysis and Optimization of Circuit Interconnect PerformanceHigh Performance Interconnect on Cofired CeramicNew Aspects in the Reliability Design of High Density Interconnects in MCMsMCM-D Technology with Active and Passive SubstratesHigh Performance Ceramic Modules and PackagesLaser Processing in MCM-C TechnologiesLTCC Technology: Where We Are and Where We're GoingDesign and Realization of High Performance Ceramic Heat SinksAIN Cofired MCM-C/DVery Fine Line Photoimageable Thick Film Technology Developed at Hybridas, LithuaniaHigh-Performance Solid State Mass Memory ModulesMass Memory Packaging for Space ApplicationsAdvanced Multichip Modules for Telecom ApplicationsTelecom Applications of MCM TechnologyDesign and Realization of a Multichip Module as a Motion Estimator for HDTV-ApplicationsMultichip Module Applications in Satellite CommunicationsMaterials/Design Considerations for MCMsMCMs: Material Choices for Electronics and OptoelectronicsLow Permittivity Porous Silica Thin Films for MCM-C/D ApplicationsMCM Passivation Studies for Enhanced Producibility and ReliabilityBuried Thick Film Capacitors Built Up with High-K Dielectrics for MCM ApplicationsAdvances in Materials for SensorsPTC Thick Film ThermistorsEvaluation of Some Thick Film Materials for Temperature, Force, and Humidity SensorsParameters and Technology of Thick Film Electrolytic SO[subscript 2] SensorsSensors: A Great Chance for Microelectronic TechnologiesHigh Sensitivity Thermometers for Millikelvin Temperature RangeThick Films Based on Glass and Polymeric Matrices, Mechanism of ConductivityAuthor IndexKeyword Index
\ BooknewsThe 31 papers address advances in multi-chip modules for electronic packaging, emphasizing but not limited to ceramic multi-chip technology. Describes applications in satellite communications, telecommunications, and militaries; materials and processes that have led to the increased density of interconnections; and ceramic thick-film, and environmental-gas, pressure, and temperature sensors. Specific topics include analyzing and optimizing circuit interconnect performance, laser processing, ceramic heat sinks, a motion estimator for high- definition television, and low permittivity porous silica thin films. Includes a slender key-word index. Annotation c. Book News, Inc., Portland, OR (booknews.com)\ \
