Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module
This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field.
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This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field.
Foreword1Introduction2Modeling of fine powder mixing and measurement of the degree of mixing3Simulation of the flowpath in the doctor-blade and its application to raising the precision of green sheet thickness4Improving dimensional precision by firing in a reducing atmosphere5Effect of forming and firing conditions on the dimensions of ceramics6Improving the strength of tungsten metallization on alumina ceramics7Study of fine wire aluminium metallization on alumina ceramics8Electrical insulation between fine metallization on alumina ceramics, and its protection9SummaryReferencesIndex
